The aim of this work is to provide the ingredients for understanding together with knowledge of the implementation of lead-free solder alloys, soldering technology and reliability in interconnection technology. Many of the lower melting point solders have precious elements, whereas some of the inexpensive alternatives wet poorly, are prone to oxidation during soldering and tend to corrode. The main candidate can be SnCu, SnAg, SnAgCu, solders system with small amount of Bi and In. During soldering, some of the metal substrate is dissolved into the molten solder. As a result, the solder becomes Lead-Free Soldering in Microelectronics - Erika Hodúlová od authora Erika Hodúlová a nakladatelství za skvělé ceny na e-shopu Martinus. cz.